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Beilstein J. Nanotechnol. 2024, 15, 1–12, doi:10.3762/bjnano.15.1
Figure 1: Lift-off fabrication process.
Figure 2: SEM images of the 3 mm TEM window grid that provides nine windows of free-standing 50 nm thick SiN ...
Figure 3: (a) Electron beam exposure scheme. (b) Cross section of developed resist with multi-dose exposure o...
Figure 4: HRTEM image of a Py nanodisk. The grain sizes are around 6 nm.
Figure 5: (a) SEM image of a Py disk (1 µm diameter, 50 nm thickness) at a tilt angle. (b) TEM image of a Py ...
Figure 6: Ion beam etching process.
Figure 7: Comparison between normal patterned resist (top) and reflowed resist (bottom). From left to right: ...
Figure 8: (a) SEM image of a Py disk (1 µm diameter, 80 nm thickness) at a tilt angle. (b) TEM image of a Py ...
Figure 9: (a) Hard mask preparation. (b) SEM image of the hard mask. (c) SEM images of deposited Py and a 1 µ...
Figure 10: SiN membrane preparation on a nanostructure.
Figure 11: (a) Lithography mask. (b) Etched substrate still attached to the bulk substrate. (c) Free-standing ...
Figure 12: Tilted sample and the external magnetic field component.
Figure 13: (a) Simplified illustration of the LTEM technique. (b) LTEM image of a 1 µm Py disk. (c) LTEM image...
Figure 14: Magnetic induction map of a nanodisk under various magnetic fields obtained by off-axis electron ho...